{"product_id":"9789355855992","title":"ELECTRONIC MATERIALS \u0026 COMPONENTS for Online Examination K Scheme (II - E\u0026Tc\/ECE\/ELEX. - 312316)","description":"\u003cp\u003eSyllabus \tElectronic Materials \u0026amp; Components - (312316)  Learning Scheme\t    Credits\tAssessment Scheme Actual Contact Hrs.\/Week\t   SLH\t   NLH\t\t  Paper Duration\t  Theory\t Based on LL \u0026amp; TL\t Based on SL\t Total Marks  CL\t TL\t LL\t\t\t\t\t\tPractical\t\t \t\t\t\t\t\t\tFA-TH\tSA-TH\t Total\tFA-PR\tSA-PR\tSLA\t \t\t\t\t\t\t\tMax\tMax\tMax\tMin\tMax\tMin\tMax\tMin\tMax\tMin\t 3\t-\t2\t1\t6\t3\t1.5\t30\t70\t100\t40\t25\t10\t-\t-\t25\t10\t150  Sr. No.\tTheory Learning Outcomes (TLO's) aligned to CO's.\tLearning content mapped with Theory Learning Outcomes (TLO's) and CO's. 1.\tTLO 1.1\tExplain the effect of the given factor on the resistivity of electrical material. TLO 1.2\tDescribe the characteristics of the given semiconductor material. TLO 1.3\tDescribe the properties of the given Photo emissive material. TLO 1.4\tExplain the phenomenon of dielectric material. TLO 1.5\tSelect the dielectric material for the given application. TLO 1.6\tClassify the magnetic material on the basis of given magnetic properties\tUnit - I Electronic Materials 1.1\t\tFactors affecting the resistivity of material like temperature, area of cross-section, length (or distance) of the element. 1.2\tSemiconductor materials: Intrinsic, extrinsic, charge carriers, P type and N Type, applications 1.3\tPhoto emissive materials: Properties, applications 1.4\tDielectric Materials: Types, Properties, Effect of frequency on performance of dielectric materials 1.5\tMagnetic Materials: Properties, classification : Permanent magnetic dipole, diamagnetism, paramagnetism, ferromagnetism. 1.6\tSoldering materials: Alloys and fluxes. (Chapter - 1) 2.\tTLO 2.1\tDescribe the property of passive component for the given parameter. TLO 2.2\tClassify the active components TLO 2.3\tSuggest the relevant combination of materials for the LED of the given color TLO 2.4\tDescribe the given type of IC and its package. TLO 2.5 \tDifferentiate between the given types of ICs. TLO 2.6\tIdentify the relevant micro devices for the given application\/s\tUnit - II   Electronic Components 2.1\tPassive Components: Concepts of Resistance, Capacitance , Inductance. Specifications, type and applications Voltage Dependent Resistor (VDR),Temperature Dependent Resistor (TDR), Light Dependent Resistor (LDR). 2.2\tElectronic Materials and doping level for PN junction diode, Zener diode, LEDs, PNP and NPN transistor. 2.3\tConstruction, working principle and applications of OLED 2.4\tIntegrated Circuit: Introduction to Monolithic IC, thick \u0026amp; thin film IC, Hybrid IC, Linear IC, Digital IC and IC packages (SIP, TO5, Flat, DIP), Pin , Device Identification, Temperature ranges. 2.5 Types and applications of micro electronic components : Micro motors, Micro relay, Microswitches. (Chapter - 2)   3.\tTLO 3.1\tExplain SMT and SMD. TLO 3.2\tDescribe the steps involved in the assembly technique in the SMT. TLO 3.3\tDifferentiate between the given type of the soldering \/ desoldering in SMT. TLO 3.4\tIdentify the need of SMT with respect to its advantages. TLO 3.5\tClassify the SMD packages with respect to the given type of components. \tUnit - III   Surface Mount Devices 3.1\tIntroduction to Surface Mount Technology (SMT) and Surface mount Devices (SMD). 3.2\tAssembly and rework techniques: Contact and noncontact types of soldering and de-soldering 3.3\tAdvantages and Disadvantages of SMT 3.4\tSMD packages : Two terminal package for passive and active components, Three or four terminal packages, five or six terminal packages, More than six terminal packages; Examples of each 3.5\tAutomatic component insertion technique (Chapter - 3) 4.\tTLO 4.1\tDescribe the constructional features of the given type of PCB. TLO 4.2\tCompare the constructional features of the given type of PCB. TLO 4.3\tIdentify the types of the PCB with respect to applications. TLO 4.4\tDescribe the given method of PCB printing. TLO 4.5 \tDescribe Electronic Waste Management.\tUnit - IV   Printed Circuit Board 4.1\tIntroduction to PCB, Advantages, disadvantages of PCB, Types of PCB and applications 4.2\tConstructional features of PCB 4.3\tFlexible PCB, Multilayer PCB, plated through hole (PTH) 4.4\tScreen printing, photo-printing methods 4.5\tSoldering Techniques: Dip, wave. reflow 4.6\tPCB testing 4.7 \tNeed of Electronic waste management , E-Waste Recycling.  (Chapter - 4) 5.\tTLO 5.1\tState the basic principle of Photovoltaic Cell for the given application. TLO 5.2\tIllustrate construction of solar panel. TLO 5.3\tList the different types of solar energy storage system  for the given specifications TLO 5.4\tExplain use of battery bank for solar power system. TLO 5.5\tChoose the suitable battery for a solar energy system.\tUnit - V   Solar system components 5.1\tPhotovoltaic materials, properties and applications. 5.2\tSolar Cell: Working Principle and Construction 5.3\tMaterials used in a Solar Panel 5.4\tEnergy storage system used in solar panel, its ratings and selection factors. 5.5\tTerminologies used in energy storage system like capacity, power ratings, depth of discharge (DoD),round-trip efficiency, warranty and life span (Chapter - 5)\u003c\/p\u003e","brand":"Technical Publications","offers":[{"title":"Default Title","offer_id":48202946707748,"sku":"9789355855992","price":180.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0671\/3661\/8788\/files\/9789355855992_1.jpg?v=1709729620","url":"https:\/\/bookstation.in\/products\/9789355855992","provider":"BookStation","version":"1.0","type":"link"}